Home
Advanced Search
Browse
by Author
by Title
by Subject
by Year
by Academic Program/FoS
by Callnumber
by Type
Contact Us
Login
Select a search option
Author
Title
Subject
Year
Academic Program/FoS
Callnumber
Chairperson
by Examination Commitee
Scholarship Donor
Search Now
Results For "Chip scale packaging" in Subject
1 Results on December 23, 2024
Browse by School
S E R D
S E T
S O M
(S E R D) + (S E T)
(S E R D) + (S O M)
S A T
School of Civil Engineering
Student Research Before 1978
Browse by Type
Capstone Project
Dissertation
Past Examination Papers
Project
Research Report
Research Study Project Report (RSPR)
Special Study Project Report (SSPR)
Thesis
Sort by
Title Ascending
Title Descending
Year Ascending
Year Descending
FEA modeling study on the reliability and performance of a flip-chip IC package
by
Zhang, Nina
Callnumber:
AIT Thesis no.ME-03-08
First
Prev
1
Next
Last