| Author | Nuttapol Kerdput |
| Call Number | AIT Thesis no.CM-04-05 |
| Subject(s) | Pavements, Reinforced concrete
Sealing (Technology)
|
| Note | A thesis submitted in partial fu lfillment of the requirements for the degree of Master of Engineering, School of Civil Engineering |
| Publisher | Asian Institute of Technology |
| Series Statement | Thesis ; no. CM-04-05 |
| Abstract | This research work developes the finite element method to analyze the sealant in rigid
pavement joint by focusing on its behavior under different shape factor, temperature and
local environmental in Thailand to obtain a joint sealant damage mechanism from various
factors and its deterioration respect to its service time. The 3D finite element analysis of
the rigid pavement joint sealant and joint sealant fatigue property are presented. The
displacement of slab edge surface on both sides of the rigid pavement expansion joint by
traffic loading and curling effect can cause stress-strain in the joint sealant. This study
conducts an experiment to obtain the fatigue property of the joint sealant that is subjected
to cyclic movement which is induced by the traffic load and the curling effect in the rigid
pavement slab. The results of the behavior analysis of joint sealant under different
configurations and the damage analysis of joint sealant under fatigue loading are
presented by the stress-strain and the relation of the percentage of joint sealant damage
with respect to its service life respectively. This study can help better monitor the rigid
pavement joint sealant deterioration under temperature and local environment in order to
effectively maintain joint sealant performance and its serviceability at an acceptable level. |
| Year | 2004 |
| Corresponding Series Added Entry | Asian Institute of Technology. Thesis ; no. CM-04-05 |
| Type | Thesis |
| School | School of Civil Engineering |
| Department | Other Field of Studies (No Department) |
| Academic Program/FoS | Construction Engineering and Infrastructure Management (CM) |
| Chairperson(s) | Pannapa Herabat; |
| Examination Committee(s) | Hadikusumo, Bonaventura H.W. ;
Pichai Nimityongskul;
Barry, William J. ; |
| Scholarship Donor(s) | Asian Institute of Technology Fellowship; |
| Degree | Thesis (M.Eng.) - Asian Institute of Technology, 2004 |
