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Reseach on the eework process for defective HGA from the solder jet bonding process | |
Author | Reangroaj Roajanasiri |
Call Number | AIT Diss. no.ISE-13-06 |
Subject(s) | Bonding process--Research Solder jet--Research |
Note | A dissertation submitted in partial fulfillment of the requirements for the degree of Doctoral of Engineering of Engineering in Mechatronics, School of Engineering and Technology |
Publisher | Asian Institute of Technology |
Series Statement | Dissertation ; no. ISE-13-06 |
Abstract | The Tunnelling Magneto Resistance ( TuMR ) reader is the important technology in th e hard disk drive. The TuMR magnetic sensor senses the magnetic field with high sensitivity. In the mass manufacturing of hard disk drive, the Head Gimbals Assembly (HGA) process consider ed the TuMR head assembly on the suspension arm and connect ed the head circuit. With the extremely small size 50 to70 micrometers of connector, t he connecting yield was contributed by the bridging defect from the solder jet bonding process about 0.5% to 1% . This thesis s tudied the solder bridging reworking without damage of the TuMR head and the mechanical properties. The TuMR head on the HGA was easily damaged or degrade from the high temperature which will create the Pin Layer Reversal (PLR) problem . The high heat flux with the short time and double pulse shape heating wer e invented from the transient heat transfer simulation with non- linear parameters. The validation has done on the solder model volume and the experiment on the prototype tools with the laser heating. From the experiment, the optimized rework parameter show ed the double pulse heating perform better the temperature control result than the single pulse heating. The experimental results also showed that the nitrogen jet beam was suitable for the rework for small and groove surface when we compare to the vacuum suction removal technique. |
Year | 2013 |
Corresponding Series Added Entry | Asian Institute of Technology. Dissertation ; no. ISE-13-06 |
Type | Dissertation |
School | School of Engineering and Technology (SET) |
Department | Department of Industrial Systems Engineering (DISE) |
Academic Program/FoS | Industrial Systems Engineering (ISE) |
Chairperson(s) | Afzulpurkar, Nitin V. ; |
Examination Committee(s) | Bohez, Erik L.J. ;Siridech Boonsang ;Theerasak Sa -nquanmanasak ;Wiroj Limtrakarn ;Bargmann, Brent; |
Scholarship Donor(s) | HDDI -DSTAR -NECTEC , Thailand; |
Degree | Thesis (Ph. D.) - Asian Institute of Technology, 2013 |